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Test & Burn-In (Zero Insertion Pressure) Sockets

Since 1979. Prime has been a primary provider of leading Test & Burn-In socket manufacturers that include: Aries, Enplas, Loranger, Plastronics, Sensata, Wells-CTI, and Yamaichi.

Standard devices include: CSP, BGA, LGA, QFP, QFN/MLF, PGA, SOIC, SOJ, TSOP, TO, DIP, SIP. Custom sockets are available for non-standard devices. Receptacles, also known as Socket Savers, are available for most socket requirements.

Burn-In sockets are Zero-Insertion-Force (ZIF) sockets that do not deform a device's leads.

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Test and Burn-In Sockets (Zero Insertion Pressure)

Aries Electronics
Aries: Manufacturer of IC interconnections including Correct-A-Chip® technology. Known for sockets ranging from high-end Test, Test/Burn-In, High Reliability sockets and adapters to low-cost production sockets.
Enplas Logo
Enplas: Globally renowned for high precision plastic injection molding technologies as well as a leading manufacturer of IC Test and Burn-in sockets.
Yamaichi Electronics
Yamaichi: Known for Board-to-Board / Board-to-Cable and I/O (In-Out ) connectors. The product range also includes excellent high speed connectors and cables, state-of-the-art Memory and SmartCard solutions as well as the new AdvancedMC connector technology.
Ironwood Electronics
Ironwood Electronics: Niche socket manufacturer specializing in GHz sockets & committed to developing new technologies & methods for testing ICs at high frequencies, i.e. BGA and QFN sockets for test at >75GHz with smallest footprint for prototype/test applications at a pitch of 0.15mm to 1.27mm. An extensive variety of adapters is available for BGA/SMT, prototype, conversion & fixes adapters.
Plastronics Sockets and Connectors
Plastronics: Invented the first open-top socket for production burn-in of LCC and PLCC packages. Now offering the most comprehensive QFN product listing in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for leaded, LGA and BGA devices.
Wells CTI Sensata Technologies
Well CTI/Sensata: Offers semiconductor interconnect burn-in sockets in the latest package technologies, including: BGA (Ball Grid Array) , CSP (Chip Scale Packages), Pb(Lead) & Pbfree (Lead-free) solder, POP (Package on Package), SIP (Single Inline Pin), Stacked die, & Stacked package.
Loranger International
Loranger: Designs and manufactures sockets, printed circuit boards and environmental systems for electronic test and burn-in. The database includes over 3,000 sockets, including 1,100 QFN sockets.

High GHz Test/Burn-In Sockets (SBT Group) ZIF
CSP (Chip Scale Package)
LGA (Land Grid Array)
QFN (Through-Hole)
OQN (Open Quad)
High GHz Test/Burn-In  Sockets (SBT Group)  ZIF
CSP  (Chip Scale Package)
LGA (Land Grid Array)
QFN (Through-Hole)
OQN (Open Quad)
• BGA, LGA, QFN/MLF, QFP & SOIC
• 7 to 31.7 GHz, -55 to +180°C
• 0.4 to 1.27mm Pitch
• BGA, QFP, QFN/MLF, TSSOP
• Compression Mount or Through-Hole
• 0.4mm to 0.8mm
• ZIF
• 0.25mm Pitch and Greater
• Up to 2,500 Contacts
• 0.25mm to 0.44mm Pitch
• C-res. 50m-ohm or less, 10,000 life cycle
• Clam Shell or Open Top
• 0.5mm to 0.65mm Pitch
• C-res. 50m-ohm or less, 10,000 life cycle
• -65 to +150°C

BGA/LGA
LGA/BGA
BGA/FBGA
FBGA
BGA - Memory Sockets
BGA/LGA
LGA/BGA
BGA/FBGA
FBGA
BGA - Memory Sockets
• Compression Surface Mount
• Open Top or Clam Shell
• 0.65 to 0.4mm Pitch
• Open Top or Clam Shell
• 800m-ohm or Less, 10,000 Life Cycle
• 0.8 to 1.27mm Pitch
• Open Top or Clam Shell
• 10,000 Life Cycle
• 0.5mm to 1.0mm Pitch
• Open Top
• 0.75mm-0.8mm Pitch
• -65 to +150°C
• Open Top Actuated Sockets
• Multiple Package Outlines & Heights
• Removable Adapter

QFP - For Gull Wing Leads
SO, SOIC, Gull Wing
Open Top, Through Hole
TSOP
Unique Positive Locking Lid
TO - Transistor Outline Socket
Socket Receptacles
QFP - For Gull Wing Leads
SO, SOIC, Gull Wing Open Top, Through Hole
TSOP Unique Positive Locking Lid
TO - Transistor Outline Socket
Socket Receptacles
• Open Top or Clam Shell
• 0.4 to 1.0mm Pitch
• 10,000 Life Cycles; -65C to +150°C
• SOP: 1.27mm
• SSOP-0.5 to 0.8mm
• TSSOP - 0.5 to 0.65mm
• SMT & ZIF
• For Prototyping, OEM, Test
• With or Without Alignment Pins
• Top-Loading & Clam Shell (ZIF)
• Kelvin & Single-Sided Contacts
• Positive Contact Wiping Action
• Protect Valuable Test & Burn-In sockets
• Can be Custom Manufactured
• Soldered or Wire wrapped to the PCB

PGA - ZIF
ZIP DIP
LCC
PLCC
Optical Transceiver Sockets
PGA - ZIF
ZIP DIP
LCC
PLCC
Optical Transceiver Sockets
• Over 10,000 Insertions
• 10x10 to 25x25 Grid on 1.00mm Centers
• Fully Loaded or Custom Pattern
• Over 10,000 Insertions
• .100" (2.54 mm)
• 14 to 64 Leads
• Open Top or Clam Shell
• From 0.25mm
• Live or Dead Bug Options
• Surface Mount/Through-Hole
• RoHS Compliant
• Compatible with Automated Loading Equipment
• Surface Mount
• 0.5 to 1.27mm
• 50,000 Insertions

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