IMPORTANT

Processing Information for High Temperature Burn-In Applications

Spinodal C72900, a copper nickel tin spinodal alloy, provides high reliability at an economical cost for burn-in applications in temperature ranges from 150°C to 200°C. Spinodal delivers superior stress relaxation for long life in addition to excellent surface characteristics which simplify processing. Spinodal exhibits good shelf life and good soldering. Mild cleaning solutions and less aggressive fluxe scan be used in plating and soldering steps.

Good engineering practice requires that a solder have a melting point of at least 50°C above the rated operating temperature of the parts being soldered. Even though initial use of the board may be at a temperature lower than 200°C, the solder used should be rated for use at the maximum temperature to allow for later use at that temperature.

The melting point of tin/antimony solder is too low for use in the high temperature applications. Temperature drift, "hot spots," and resistive heating in an oven could cause conditions that would allow the solder to soften, melt or create other solder joint weakness.

All solders containing more than 20% tin will have melting points below the recommended value.

When Spinodal is used for high temperature burn-in applications, in common with all copper based alloys, high temperature solders are recommended. The use of high tin solder is not recommended for burn-in applications in the 150°C to 200°C range.

Please contact your solder supplier for specified details.