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BGA / LGA / CSP
Available as 0.5mm and 0.65mm parts tables
(by pitch).
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Double Stacked Spring Pin Test & Burn-in Socket for Processor and Memory
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Designed for 60 and 80 pin BGA packages.
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For focused electron beam testing applications or micro probing applications.
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10 GHz Clamshell Socket for 0.4mm Pitch BGA Packages
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Open Top Chip and CSP/LGA Socket for .50 MM pitch CSP Packages with High Performance Pogo Pin
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