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BGA, BGA/LGA, FBGA
BGA Test & Burn-In Socket. SMT type, Open Top design.
IC Application: BGA, 0.4, 0.5, 0.65mm pitch.
Order Series: OTB/OTL.
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BGA/LGA Test, Burn-In Socket. SMT type, Clam Shell lid design. from ENPLAS, leading manufacturer in socket design and manufacturing.
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BGA/FBGA Test & Burn-In Socket. Through-Hole type, Open-Top lid design.
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Ironwood Electronics has recently introduced SBT sockets that are small footprint sockets and compatible with other product lines such as GHz elastomer sockets,Giga-Spring sockets, etc
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BGA Test & Burn-In Socket. Thru-Hole type, Open Top design.
IC Application: BGA, 1.0, 1.27mm pitch.
Order Series: OTB.
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Available as 0.8mm, 1.0mm and 1.27mm parts tables
(by pitch).
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Open Top Land Grid Array (LGA) Socket for Microarray Packages from Wells/CTI
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Price: Please call for pricing and availability
LGA CSP Socket for Microarray Packages from Wells/CTI
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Price: Please call for pricing and availability
Multisite Clamshell Chip Scale Package//Land Grid Array (LGA) Socket for .50mm and 1.00 mm pitch Chip Scale Packages 71XM Series
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