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Low Insertion Force Pin Grid Array Sockets for prototyping or production. 100" (2.54mm) Pitch Interstitial Footprints
Features: - Available in new LCP high temperature molded insulators (RSX) or Peel-A-Way removable terminal carriers (KSX)
- .100" (2.54mm) centers pin to pin
- Multiple finger contact for reliability
- Tapered entry for ease of insertion
- Closed end construction for 100% anti-wicking of solder
- Available with SnPb or lead-free Sn/Ag/Cu solder preform terminals
- Available with Matte Tin/Gold or Gold/Gold terminal/contact plating for RoHS Compliant applications
Terminals: Brass - Copper Alloy C36000, ASTM-B-16
Contacts: Beryllium Copper - Copper Alloy C17200, ASTM-B-194
RoHS Compliant: G - Gold over Nickel or M - Matte Tin over Nickel
RoHS Noncompliant: T - Tin-Lead over Nickel
RoHS Compliant: G - Gold over Nickel
RoHS Noncompliant: T - Tin-Lead over Nickel
Material: RSX - LCP Liquid Crystal Polymer
KSX - Polyimide Film
Peel Away: Y
RSX: -40C to 260C (-40F to 500F)
KSX: -269C to 400C (-452C to 752F)
Prime Distributing Co. is an Authorized Distributor for Advanced Interconnections and has been a leader in technical socket sales with kindly service for over 35years.
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