You searched for all products made by Advanced Interconnections
 Peel-A-Way® Single In-Line Adapters
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Single In-Line Solid Adapter Strips
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Peel-A-Way® Single In-Line Sockets and Adapters for Surface Mount Applications
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Single In-Line Solid Socket Strips
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Dual In-Line Adapters
Discrete Component Carriers
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New BGA Interposers from Advanced Interconnections are a cost-effective method for converting lead-free BGA device packages for use on boards processed with lower temperature, Tin/Lead solder profiles.
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Advanced designs and manufactures hundreds of screw-machined terminals for high quality sockets, adapters, and connectors. Advanced also offers a complete line of EMC® insulated and non-insulated terminals and test jacks
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SMT Connectors, featuring solder ball terminals, provide method to define stack height between two PC boards.
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Sockets surface mount to PCB
Supplied in high temperature Peel-A-Way® socket terminal carrier
Peel-A-Way® carrier can be left in place for added stability
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SMT Surface Mount custom PGA connector
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Peel-A-Way; Single In-Line Sockets
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Peel-A-Way DIP Socket, uniquely developed by Advanced Interconnections. Also called, Terminal Carriers. After soldering, peel away polymide film for complete joint visibility or leave in place for added stability.
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Price: Please Call For Pricing
High Temperature Molded Closed Frame DIP Sockets. From minus 100deg. F to 500deg.F
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Staggered PGA Interstitial PGA Sockets .100" (2.54mm) pitch staggered interstitialAvailable in molded or high temperature Peel-A-Way removable terminal carrierMultiple finger contactTapered entry for ease of insertionClosed end construc
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Relay Sockets featuring Peel-A-Way® removable delivery system
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Features and Terminals for Peel-A-Way Low Insertion Force PGA Sockets - Disposable carriers peel away after soldering
- Peel-A-Way tabs and full grid wafer supplied
- Maximum air flow under PGA for greater cooling
- Allows inspection of
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High Temperature Molded Open Frame DIP Sockets, Liquid Crystal Polymer (LCP). Minus 40 degrees F to 500 degrees F).
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Relay Sockets featuring Peel-A-Way® removable delivery system
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1mm Low Profile SMT Connectors. New Mezza-pede™ SMT Connectors from Advanced Interconnections Corp. are designed for 1mm pitch micro board-to-board and flex cable-to-board applications.
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Features & Terminals for Molded & FR-4 Low Insertion Force PGA Sockets - As low as 1 oz. (28.34 g) average insertion force per pin
- Multiple finger contacts for reliability
- Over 400 PGA footprints available
- Closed bottom terminal f
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Pin Grid Array Adapters - Screw machined terminals
- Easily customized to fit your application
- Available in molded or Peel-A-Way body types
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Peel-A-Way Sheets of Sockets Customizable socket in removable carriers increase socket loading rateEliminates the need for hand-loading.
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Closed Frame LED (Light Emitting Diode) Sockets
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