Pad-snaP™ QFN/MLF SMD Adapters, Easy to Solder, High Performance The SF-QFN/MLF small footprint Surface Mount Package Emulator Feet for all sizes of QFN/MLF and pitch from 0 .45mm to 0.65 and many body sizes. These devices use patent pending technology to achieve a reliable and small SMT QFN/MLF adapter. The SF-QFN/MLF has pads on the bottom that precisely match the pin layout for the QFN/MLF package including the E-pad or heatsink pad in the center of the pattern. This allows connection to a QFN/MLF land pattern of target board to provide a set of interconnects available for probing or connecting to another assembly. The user simply solders the SF-QFN/MLF SMD adapter using the same solder reflow and attachment methods used for a QFN/MLF IC.
The SF-QFN/MLF-XXX is the same size as the QFN/MLF IC in the XY dimension and only 3.3 mm high. The top of the after being attached to the target consists of female, machined socket pins with all gold plating for maximum reliability. Compatible gold plated male pin adapters are then plugged in and emulation, probing, or interconnect of the QFN/MLF is accomplished. Many sizes of QFN/MLF SMT adapters are available in this product line.

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