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777 Series Open Top CSP Socket- Open Top Chip Scale Package
- Accomodates pitch sizes of .75mm and .80mm
- Compact size and Low Actuation Force
- 4 Point pinch design for enhanced electrical contact
- Unique mechanism to eliminate solder ball sticking
- Field replaceable package location plate
Materials & Specifications
- Socket Body: PES,PEI, LCP or Equivalent
- Contacts: Beryllium Copper Alloy
- Contact Plating: NIPd or Gold
- Contact Normal Force: 10 grams
- Contact Resistance: 100 mO max
- Dielectric: 700V AC for 1 minute.
- Temperature Rating: 150°C
- Durability: 10,000 cycles min.
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