Compact design conserves board space by combining many signal, ground, and power pins in a dense area.

Features:

• High density .050" (1.27mm) pitch - over 400 contacts per square inch
• Robust screw-machined terminals with multi-finger contacts can withstand the demands of blind mating and rigorous mating/unmating cycles.
• Precision molded in high temperature LCP with integral polarization keying features to prevent 180° out-of-orientation mismating.
• At 3 amps per pin, more contacts can be assigned to data/signal transfer (fewer pins needed to handle power and ground).
• Guide box design facilitates alignment of male pin into female receptacle while protecting pins from damage during board mating.
• Industry standard footprints in four mated heights (Standard stack heights: 6.00mm, 8.00mm, 12.70mm and 19.05mm - Consult factory for availability.)
• Custom configurations available
• RoHS Compliant models available featuring new Sn/Ag/Cu solder ball terminals
  

Terminals:   Brass; Copper Alloy (C36000), ASTM-B-16

Solder Ball:

• Standard:   63Sn/37Pb
• Lead-Free:   Sn/Ag/Cu

Contacts:   Beryllium Copper Alloy C17200, ASTM-B-194

Terminal Plating:   Gold over Nickel

Contact Plating:   Gold over Nickel

Body Material:   High Temp. (Molded) LCP Liquid Crystal Polymer

Temp° Range:   -40°C to 260°C (-40°F to 500°F)

Part Number:   BA, BB

RELATED DOCUMENTS

B2B App Note

Quantity pricing available

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